Tresky GmbH won the State at Brandenburg 2021 Innovation Award 2021 in the metal category. The manufacturer of innovative die bonders from Hennigsdorf near Berlin has prevailed against the competition with the newly developed air-bearing bond head, which will be presented to the professional public for the first time at Productronica 2021.
In order to achieve minimal contact force during bonding, Tresky GmbH has developed an air-bearing bond head that enables clearance and friction free vertical movement when the chip is placed. The air bearing is kept suspended by vacuum or compressed air and controlled by a proportional valve that can operate from vacuum to atmospheric pressure. The bond head recognizes changing weights and can therefore maintain its floating state at all times. This results in a weight compensation of the component. By changing the proportional valve from vacuum to pressure, a defined weight force can now be exerted in the vertical direction on the semiconductor component and be placed or absorbed with an exact force.