Flip Chip Bonding
During the flip-chip process, the chip is placed directly onto the circuit boards, without additional connection wires and with the active surface facing down. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad. Tresky’s modular die bonding equipment with the most common Flip-Chip option, based on a optical vision system, allows high accuracy placement by one ore multiple points.
Tresky T-6000 series and T-8000 allows different Flip-Chip bonding processes, such as soldering, adhesive or ultrasonic bonding. Process parameters can be easily adjusted for optimized results. Temperature, time and force can be adjusted respectively programmed independently.
Process - C4 Soldering
In the C4 process (Controlled Collapse Chip Connection), the chip bumps are soldered onto the package substrate for electrical connection.
Process - Eutectic
Eutectic soldering process for Au/ Sn bumped dies, especially suitable for optoelectronic and RF devices.
Process - Adhesive Technology
Dispense ACP or NCP glue on substrate. Bumped chip, aligned by beam splitter, placed into glue and cured.
Process - Underfill
Used for complete bottom side encapsulated Flip-Chip, mainly with an epoxy based material.
Process - Ultrasonic
During placement, the energy required for the welding process comes in the form of mechanical vibrations.