News Detail

25.09.2018 08:28 Age: 22 days

ESTC Conference 2018 Dresden

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, last week was very successful. Tresky GmbH, was present to discuss and share information about die bonding.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.