SMT Connect 2019 Nuremberg
Come and visit us this week at the SMTconnect from May 7th until May 9th at the Nürnberg Messe in Germany.
The trade fair SMT Hybrid Packaging takes place this year under a new name SMTconnect with the new motto: "Solutions for electronic assemblies and systems". At our booth 4A/331 you will experience interesting automated bonding solutions for die attach and flip chip bonding.
The SMTconnect is the ideal setting where the electronic production community comes together for sharing ideas. A wide range of highly professional podium discussions, product unveilings and company presentations can be experienced at Europe’s leading event for system integration in microelectronics.