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About Us

Our new white pager regarding pressure-assisted metallic sintering in power electronics is now available for download.

We are one of the world’s leading machine manufacturers for placement systems in the high-precision sector offering more than 40 years of experience in the semiconductor industry.

Tresky GmbH

TRESKY GmbH is headquartered in Hennigsdorf near Berlin, in the middle of a technology park that is home to numerous highly specialized companies from the automation, electrical engineering, communications technology and life science sectors.


TRESKY is one of the fastest growing employers in the region around Hennigsdorf. Since the company split in 2017, the number of employees has grown from 6 to currently 25. TRESKY’s team consists of experienced specialists, engineers and innovative working students.

Since 1980 the Name TRESKY Stands for the Highest Quality, Unmatched Flexibility with Maximum Reliability

Quality "Made in Germany"

We develop, produce and sell Die Bonders from our headquarters in Hennigsdorf. This is near Berlin, Germany.

One Machine, Unlimited Bonding Processes

All standard packaging technologies can be realized with one flexible TRESKY machine. We have extensive experience with multi-chip module applications. It is one of our many strengths.

Designed for Tomorrow’s Semiconductor Needs

The semiconductor market leads the way for many other markets and is therefore constantly changing. Thanks to our modular and flexible machine concept, combined with our numerous innovative options, we enable our customers to react quickly to new technologies, product requirements and new market situations.

Best Bonding Performance in the Market

Our equipment is optimally matched to the requirements of our customers. We record the wishes of our customers and incorporate our many years of experience into the process. This creates critical partnerships with our customers that leads to full satisfaction and long-term business relationships.

Manual Mode

As a special feature, all our machines offer a manual mode in which die bonding proto-type and R&D development can be carried out quickly and precisely without complex programming.

From Prototyping to Production

Whether in the development of a prototype or in any process step that is important for the creation of a customized Die Bonder – we are involved in the planning from the very beginning.