Machines Portfolio

T-6000-L

TRESKY's entry-level die bonder

The ultimate bonding platform from prototyping to volume production.

  • Travel Range with Wafer: 400 mm x 410 mm
  • Bond Force Range: 10 g up to 10.000 g
  • Placement Accuracy: 8 μm @ 3 sigma

T-6000-L/G

TRESKY's further enhanced T-6000-L

The ultimate bonding platform, based on a granite gantry to achieve the highest level of bonding accuracy for prototyping and volume production.

  • Travel Range with Wafer: 400 mm x 420 mm
  • Bond Force Range: 10 g up to 10.000 g
  • Placement Accuracy: 2.5 μm @ 3 sigma

T-8000-G

TRESKY's T-8000-G offers a larger work area and it can handle 12” wafers

The ultimate bonding platform, build on a bigger granite gantry to combine space with the highest level of bonding accuracy,  for prototyping and volume production.

  • Travel Range with Wafer: 590 mm x 560 mm
  • Bond Force Range: 10 g up to 10.000 g
  • Placement Accuracy: 2.5 μm @ 3 sigma

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