T-6000-L
TRESKY's entry-level DIE bonder
The ultimate bonding platform from prototyping to volume production.
- Travel Range with Wafer: 400 mm x 410 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 8 μm @ 3 sigma
T-6000-L/G
TRESKY's further enhanced T-6000-L
The ultimate bonding platform, based on a granite gantry to achieve the highest level of bonding accuracy for prototyping and volume production.
- Travel Range with Wafer: 400 mm x 420 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 2.5 μm @ 3 sigma
T-8000-G
TRESKY's T-8000-G offers a larger work area and it can handle 12” wafers
The ultimate bonding platform, build on a bigger granite gantry to combine space with the highest level of bonding accuracy, for prototyping and volume production.
- Travel Range with Wafer: 590 mm x 560 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 2.5 μm @ 3 sigma
Learn more about the different machine options
Why granite?
Especially when it comes to the highest precision requirements, machine builders from the various industries like to rely on granite. Particularly when the components to be processed are extremely small, precision comes into even sharper focus, as in the semiconductor industry with DIE bonding.
