T-6000-L
TRESKY's entry-level die bonder
The ultimate bonding platform from prototyping to volume production.
- Travel Range with Wafer: 400 mm x 410 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 8 μm @ 3 sigma
T-6000-L/G
TRESKY's further enhanced T-6000-L
The ultimate bonding platform, based on a granite gantry to achieve the highest level of bonding accuracy for prototyping and volume production.
- Travel Range with Wafer: 400 mm x 420 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 2.5 μm @ 3 sigma
T-8000-G
TRESKY's T-8000-G offers a larger work area and it can handle 12” wafers
The ultimate bonding platform, build on a bigger granite gantry to combine space with the highest level of bonding accuracy, for prototyping and volume production.
- Travel Range with Wafer: 590 mm x 560 mm
- Bond Force Range: 10 g up to 10.000 g
- Placement Accuracy: 2.5 μm @ 3 sigma
