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Customized DIE Bonding Processes with High Modularity

Our new white paper regarding pressure-assisted metallic sintering in power electronics is now available for download.

Tresky’s DIE bonders can be perfectly customized to meet the manufacturing requirements of the customers. Depending on the materials to be processed, cycle time, production quantities, or other specifications, Tresky’s DIE bonders can be modularly expanded and upgraded. Various options are available for this purpose, which can be selected in collaboration with process specialists as part of the machine configuration.