T-Series

Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.

Products

Options

At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Options

Technology

The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY's automated die bonder product line has several unique technology solutions therefore available.

Technology

Market Solutions

We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you.

Market Solutions


News

SEMICON Taiwan

Wednesday, 23. September 2020: SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics...

ECTC

Tuesday, 26. May 2020: ECTC is the premier international conference on microelectronic packaging, components and systems...

SMTconnect

Tuesday, 05. May 2020: Europe's event which connects people and technologies from the areas of development, production,...

ExpoElectronica

Tuesday, 14. April 2020: ExpoElectronica is the largest russian exhibition of electronic components. modules and systems. ...