Tresky product highlights

Sintering technology für e-mobility and power electronics

Packages with high-performance semiconductors are key components for the energy transition and e-mobility.  For this reason, we have been working on the sintering process for manufacturing this key technology for some time. As part of this development, we have developed pre-sintering processes, including our own process modules, which we will present this year. These pre-sintering processes can be used on all DIE bonders from Tresky. Get the first information here.

T-Pak in Carrier

Granite – Highest machine precision thanks to Mother Nature

Especially when it comes to the highest precision requirements, machine builders from the various industries like to rely on granite. Particularly when the components to be processed are extremely small, precision comes into even sharper focus, as in the semiconductor industry with DIE bonding.

Vibrating feeder

By means of vibration technology, our vibrating feeder feeds components, which are delivered as bulk material, to the processing process. The feeder is designed in such a way that the components are positioned in a vibrating, small open container in such a way that the head camera clearly and precisely recognises the individual components and automatically transmits the XY coordinates to the bonding head.

Rework of LED-DIEs

LED dies can be easily and successfully removed with a Tresky Automation system in the rework configuration.  The removal takes place without damaging adjacent LED dies and affecting the solder and its environment.

For the debonding process the scrubbing function can be used, which has been modified to break the adhesion between the LED die and the solder using the heating temperature. After the LED die is separated from the solder, a tool picks it up.

For further information, please refer to the PDF offered here.

Trade fairs & Exhibitions


Meet us at the


Augsburg, GER | 30th –31th september 2023

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