T-Series

Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.

Products

Options

At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Options

Technology

The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY's automated die bonder product line has several unique technology solutions therefore available.

Technology

Market Solutions

We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you.

Market Solutions


Productronica 2019

We had four great and successful days at Productronica 2019.

Thank you for visiting our booth. We had a lot of interesting conversations.

It was a pleasure to meet all of you!

 

 

 

 

 

News

SEMICON Taiwan

Wednesday, 23. September 2020: SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics...

ECTC

Tuesday, 26. May 2020: ECTC is the premier international conference on microelectronic packaging, components and systems...

SMTconnect

Tuesday, 05. May 2020: Europe's event which connects people and technologies from the areas of development, production,...

ExpoElectronica

Tuesday, 14. April 2020: ExpoElectronica is the largest russian exhibition of electronic components. modules and systems. ...