By means of vibration technology, our vibrating feeder feeds components, which are delivered as bulk material, to the processing process. The feeder is designed in such a way that the components are positioned in a vibrating, small open container in such a way that the head camera clearly and precisely recognises the individual components and automatically transmits the XY coordinates to the bonding head.
Rework of LED-Dies
LED dies can be easily and successfully removed with a Tresky Automation system in the rework configuration. The removal takes place without damaging adjacent LED dies and affecting the solder and its environment.
For the debonding process the scrubbing function can be used, which has been modified to break the adhesion between the LED die and the solder using the heating temperature. After the LED die is separated from the solder, a tool picks it up.
For further information, please refer to the PDF offered here.