Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.



At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Options


The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY's automated die bonder product line has several unique technology solutions therefore available.


Market Solutions

We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you.

Market Solutions

Meet us!

TRESKY GmbH is exhibiting at the Nepcon Japan from 16th January to 18th of January.

We are looking forward to welcome you at our booth.

More information about other tradeshows we're visiting you can find on our tradeshow & events list.




Semicon Taiwan Show 2018

Friday, 07. September 2018: The Semicon Taiwan show has just ended and we discussed many interesting and sophisticated...

Tresky GmbH attended the...

Monday, 20. November 2017: This week, Tresky GmbH attended the Productronica 2017 in Munich and successfully introduced the...