T-Series

Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.

Products

Options

At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Options

Technology

The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY's automated die bonder product line has several unique technology solutions therefore available.

Technology

Market Solutions

We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you.

Market Solutions


Meet us!

TRESKY GmbH is exhibiting at the Semicon China from 20th March to 22th of March.

We are looking forward to welcome you at our booth.

More information about other tradeshows we're visiting you can find on our tradeshow & events list.

 

 

News

Semicon Korea 2019 Seoul

Thursday, 07. February 2019: Last week, Tresky GmbH was exhibiting at the Semicon Korea 2019 from 23th of January to 25th of...

Semicon Taiwan Show 2018

Friday, 07. September 2018: The Semicon Taiwan show has just ended and we discussed many interesting and sophisticated...