Performed to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.



At a similar level of importance comes the way the sample is handled on the T-Series during processing. The compatibility modes ensure consistency in your manufacturing results across machines. Options


The strength and accuracy of the bond is in proportion a significantly fact for a stable process. TRESKY's automated die bonder product line has several unique technology solutions therefore available.


Market Solutions

We provide custom bonding solutions to a variety of industries. Find your industry to discover how Tresky GmbH can help you.

Market Solutions

24th Annual Components for Military & Space Electronics Conference & Exhibition

The CMSE Conference is a premier event focused on the design, reliability, and application of electronic components for use in avionics aerospace, military & commercial space systems. Here you will get technical presentations by industry leaders focused on advanced packaging of ICs, passive components and a variety of other topics critical to components used in high rel mil and aerospace systems.

Booth information will follow!

When:   April, 21 - 23, 2020

Where: Four Points by Sheraton Los Angeles International Airport, Los Angeles, USA



Wednesday, 23. September 2020: SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics...


Tuesday, 11. August 2020: ExpoElectronica is the largest russian exhibition of electronic components. modules and systems. ...


Tuesday, 28. July 2020: Europe's event which connects people and technologies from the areas of development, production,...


Saturday, 27. June 2020: SEMICON China - The World’s Largest Semiconductor Industry Platform, where Market, Technology,...