Precision for Complex Bonding
|Working Area with Wafer Table||500 mm x 700 mm|
|Possible Wafer Sizes||up to 12” (ring & frame)|
|Travelling Range Z-axis||100 mm|
|Tool Rotation Max.||up to 360°|
|Bond Force Range||0.01 N – up to 300 N *|
|Axis Speed||up to 2.0 m/sec|
|Positioning Accuracy||< 1.0 μm @ 3 sigma|
|Axis Resolution||XYZ: 0.001 μm, theta: 0.005°|
|Min/Max. Chip Size||smaller than 0.05 mm|
|Acceleration||up to 2.5 G|
* higher bond forces on request
Leader in Micro-Assembly
Technological miniaturisation and functional integration in microelectronics and optoelectronics are essential for future-oriented product innovations. Micro-assembly and assembly and connection technology play a crucial role in the realization of these technological innovations in new and marketable products.
We have developed the T-7000 to successfully realize these requirements. The platform offers sub-micron placement accuracy, a travel range of 500 x 700 mm and a bonding head with minimum bonding forces of up to 0.01 N. On customer request, the bonding force range can be optionally increased to 100 N, 300 N or 500 N.
This model covers all common bonding technologies.