
Fluxless soldering using formic acid vapor for optoelectronics
Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages

Tresky Automation launches new website
The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design

Tresky unveils its latest breakthrough product at productronica 2023: the photonics bonder for sub-micron use in nano- and optoelectronics
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the

Tresky presents metallic sintering for power electronics at productronica 2023
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die

Tresky expands digital service support with Pink Flamingo
The Pink Flamingo document management and support system offers a wide range of possibilities for

Electronic low-voltage drive module with multifunctional high-current circuit carrier
Tresky GmbH is part of the ProMuPower project at Kiel University of Applied Sciences, which

Sintering as a key technology for the energy transition and e-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For

Highest machine precision thanks to Mother Nature
Particularly when it comes to the highest precision requirements, machine builders from different industries like

Perfect connection
The DIE bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding

Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special

Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies

Air-bearing bond head, new vibrating feeders and a new wafer handling system
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg,