![Picture: Large area dispensing of the Ag sinter paste using a Tresky slot nozzle](https://www.tresky.de/wp-content/uploads/2024/06/Large-area-dispensing-of-the-Ag-sinter-paste-using-a-Tresky-slot-nozzle-1-300x169.jpg)
Tresky allows dispensing of over 100 mm² for large area sintering applications
The integration of large-area power modules with an area of over 100 mm² is highly
![picture: man controls the Tresky DIE Bonder with a Computer](https://www.tresky.de/wp-content/uploads/2024/06/Maximum-control-and-flexibility-in-DIE-bonding-with-the-manual-operator-mode-of-the-Tresky-systems-e1717423797959-300x220.jpg)
Manual mode for maximum control and flexibility with DIE bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This
![Formic Acid Modul von Tresky für die Anwendunf in der Optoelektronik mit Ameisensäure](https://www.tresky.de/wp-content/uploads/2023/11/Offenes-Formic-Acid-Modul-von-Tresky-300x200.jpg)
Fluxless soldering using formic acid vapor for optoelectronics
Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages
![New Website from Tresky](https://www.tresky.de/wp-content/uploads/2023/11/Tresky-presents-itself-with-a-new-online-presence-300x200.jpg)
Tresky Automation launches new website
The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design
![Photonics Bonder unter der Kamera](https://www.tresky.de/wp-content/uploads/2023/11/Vertical-cavity-surface-emitting-laser-VCSEL-unter-der-Kamera-des-Photonics-Bonder-von-Tresky-3-300x196.jpg)
Tresky unveils its latest breakthrough product at productronica 2023: the photonics bonder for sub-micron use in nano- and optoelectronics
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the
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Tresky presents metallic sintering for power electronics at productronica 2023
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die
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Tresky expands digital service support with Pink Flamingo
The Pink Flamingo document management and support system offers a wide range of possibilities for
![](https://www.tresky.de/wp-content/uploads/2023/05/Projekt-ProMuPower-300x300.webp)
Electronic low-voltage drive module with multifunctional high-current circuit carrier
Tresky GmbH is part of the ProMuPower project at Kiel University of Applied Sciences, which
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Sintering as a key technology for the energy transition and e-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For
![](https://www.tresky.de/wp-content/uploads/2023/10/Tresky-Granit-300x169.webp)
Highest machine precision thanks to Mother Nature
Particularly when it comes to the highest precision requirements, machine builders from different industries like
![](https://www.tresky.de/wp-content/uploads/2022/10/Thermosonic-in-golden-box-300x300.webp)
Perfect connection
The DIE bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding
![](https://www.tresky.de/wp-content/uploads/2022/09/Rework-LED-DIES-300x300.webp)
Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special
![](https://www.tresky.de/wp-content/uploads/2023/10/bg-5-300x226.png)
Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies
![](https://www.tresky.de/wp-content/uploads/2023/10/0_18-8000-300x169.jpg)
Air-bearing bond head, new vibrating feeders and a new wafer handling system
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg,