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Versatility and Accuracy


TRESKY’s entry-level model, the  DIE bonder T-6000-L, is a fully automatic placement system for universal and specific use in prototyping as well as series production.

The T-6000-L offers an unprecedented level of flexibility through a high degree of modularity. Fast switching between different bonding techniques is possible at any time and the manual mode enables fast bonding results without programming.

Technical Data

Travel Range with Wafer400 mm x 410 mm
Wafer Size2” – 8” (Ring & Frame)
Travel Range w/o Wafer540 mm x 410 mm
Z-Movement100 mm
Chip Rotation Max.up to 360°
Bond Force Range0.01 N – up to 100 N *
Axis Speedup to 1.8 m/sec
Placement Accuracy8 μm @ 3 sigma
Axis ResolutionXYZ: 0.01 μm, Theta: 0.01°
Min./Max. Component Size80 μm – 100 mm **

*Higher bond forces on request
** Other dimensions on request | Note: All specifications are subject to change without prior notice

Fully Automatic and Manual

For a customized bonding result, the T-6000-L can be equipped with numerous options that can be added to the placement process at any time.

The T-6000-L guarantees reproducible and highly accurate results for any placement application and best bonding performance in the market. The unique manual mode enables instant DIE bonding.

This model covers all common bonding technologies and is designed to meet today’s and tomorrow’s challenges in semiconductor manufacturing.

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