Flexibility
TRESKY’s entry-level model, the DIE bonder T-6000-L, is a fully automatic placement system for universal and specific use in prototyping as well as series production.
The T-6000-L offers an unprecedented level of flexibility through a high degree of modularity. Fast switching between different bonding techniques is possible at any time and the manual mode enables fast bonding results without programming.
Technical Data
| Travel Range with Wafer | 400 mm x 410 mm |
| Wafer Size | 2” – 8” (Ring & Frame) |
| Travel Range w/o Wafer | 540 mm x 410 mm |
| Z-Movement | 100 mm |
| Chip Rotation Max. | up to 360° |
| Bond Force Range | 0.01 N – up to 100 N * |
| Axis Speed | up to 1.8 m/sec |
| Placement Accuracy | 8 μm @ 3 sigma |
| Axis Resolution | XYZ: 0.01 μm, Theta: 0.01° |
| Min./Max. Component Size | 80 μm – 100 mm ** |
*Higher bond forces on request
** Other dimensions on request | Note: All specifications are subject to change without prior notice
Fully Automatic and Manual
For a customized bonding result, the T-6000-L can be equipped with numerous options that can be added to the placement process at any time.
The T-6000-L guarantees reproducible and highly accurate results for any placement application and best bonding performance in the market. The unique manual mode enables instant DIE bonding.
This model covers all common bonding technologies and is designed to meet today’s and tomorrow’s challenges in semiconductor manufacturing.
Data Sheet
Product
Highlights
- Best ROI in the market
- Manual mode
- Multichip capable
- Post-bond inspection
- Software programmed temperature control
- Wafermapping
- OCR
- Traceability
- MES
- Automated dispensing needle calibration
- Customized partitioning
- Scrubbing
- Different image recognition
- Bonding in cavities (15 mm)
- Preform punching
Modules and
Options
- Air bearing bond head
- Vibrating feeder
- Wafer handling system
- Stamping module
- Component feeders
- Formic Acid Module
- UV-indexer
- Wafer table with DIE ejector
- WRGB ring light
- Heating plates (up to 450°C; ΔT-Ramps up to 60 K/s)
- Inert gas
- Automatic tool change
- Various dispensing technologies
- Tool heating
- Various feeder widths
- Uplooking camera
- ID-scanner
- DIE flipping-unit
- Heated inert gas
- Automatic wafer change
- Magazine feeder
- Inline production
Customized
applications:
- DTF / DAF bonding
- Multi-DIE bonding
- MEMS
- SMD bonding
- 3D-packaging (SiP)
- Laser-bar-stacking
- Glas bonding
- TO header bonding
- RFID assembly
- DIE sorting