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The Best Bonding Performance

The Art of Engineering

Based on the proven T-6000-L series, the DIE bonder T-6000-L/G has been further developed. This consists of a stable granite gantry and a high-precision control system for the X, Y and Z axes. The system therefore offers the best bonding performance in the market and is designed for the current and future challenges in the semiconductor industry.

Technical Data

Travel Range with Wafer 400 mm x 410 mm
Wafer Size 2” – 8” (Ring & Frame)
Travel Range w/o Wafer 540 mm x 410 mm
Z-Movement 100 mm
Chip Rotation Max. up to 360°
Bond Force Range 0.01 N – bis zu 100 N *
Axis Speed up to 1.8 m/sec
Placement Accuracy 2.5 μm @ 3 sigma
Axis Resolution XYZ: 0.01 μm, Theta: 0.01°
Min./Max. Component Size 80 μm – 100 mm **
*Higher bond forces on request ** Other dimensions on request | Note: All specifications are subject to change without prior notice

All Common Connection Technologies

The T-6000-L/G guarantees reproducible and accurate results for highly precise placement applications. Optionally, the T-6000- L/G can be upgraded with a loading and unloading module to further optimize cycle times and to reduce downtime.

Due to the wide range of process options, the T-6000-L/G offers high versatility in combination with speed and high precision. The system can be further expanded at any time with additional options. Thus, our customers receive an individual system tailored to their needs, with which both manual and fully automatic processes can be implemented reliably and effectively. The intuitive software enables simple and easy operation and programming of the system.

This model covers all common connection technologies.

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