Most RFID (Radio-frequency identification) tags contain at least two parts. One is an integrated circuit for storing and processing information, modulating and demodulating a (RF) signal, and other specialized functions. The second is an antenna for receiving and transmitting the signal. Tresky’s modular die bonding equipment delivers, once more, optimal performance in R&D and pre-production assembly as e.g.: Bonding of a Flip-Chip to antenna.
Tresky’s T-Series allows different RFID bonding processes, such as adhesive or ultrasonic bonding. Process parameters can be easily adjusted for optimized results. Temperature, time and force can be adjusted respectively programmed independently.
Required Technical Data
Bonding Parameters: Force 20g - 400g and time up to 20Sec. on final curing temperature.
Temperature: Adjustable temp. profile for chip and antenna up to 200°C with ramping speed up to 18°C/Sec.
Process - Adhesive Technology (ACP)
The ACP glue is dispensed to the antenna before chip placement and cured during the placement process.
Process - Adhesive Technology (NCP)
The RFID-Chip is placed into the dispensed NCP glue with defined “high” bonding force so that the bumps are pressed into the antenna.
Process - Ultrasonic
During placement, the ultrasonic energy is transferred to
the chip contacts, where it is transformed into heat.