The demand for contract manufacturing capacities for prototypes and small and medium-sized series in the field of assembly and connection technology remains high. Due to the geopolitical situation, manufacturers of security-relevant goods in the defense industry are increasingly requesting such services. Tresky Automation’s customers profit not only from extensive DIE bonding processes and in-depth expertise, but also from a wide range of equipment.
Tresky’s contract manufacturing service draws on a wide range of connection technologies, such as DIE bonding, wire bonding, vacuum soldering, sintering, and inspection and testing procedures. This enables the company to offer its customers innovative and reliable solutions that meet the highest quality standards. These include tasks in the fields of photonics, optoelectronics, sintering for power electronics, flip chip bonding, DIE attach, and numerous other technologies in the field of assembly and connection technology.
“Many companies are hesitant to invest directly in their own equipment, especially in the prototype development phase and for small series. Product or manufacturing process adjustments are often necessary before the final design is ready. At the same time, there is a desire to have prototypes and small quantities produced quickly and in high quality, or to reduce production peaks. This is exactly where we come in.“
The process laboratory can therefore also be rented if companies with their own personnel wish to carry out evaluations, small series production, or similar tasks.
“We provide all our laboratory equipment. This includes various DIE bonders, a vacuum press for sintering, plasma cleaners, and a stencil printer. Renting the laboratory is particularly interesting for companies that are unwilling to hand over sensitive data. Once our employees have been trained, they can use the laboratory to its full extent. We are of course available to answer any questions."
The reasons for the increasing demand from security-sensitive areas are obvious. Increasingly complex electronics are being used in military applications.
“Networked real-time communication systems, autonomously operating systems, and the reliable transfer of large amounts of data in the most demanding environments require more powerful electronic solutions. Furthermore, individual systems are becoming more compact and functional. As a result, reliable packaging solutions are rapidly becoming important in military electronics development.“
With comprehensive technical expertise and many years of experience, the Tresky team takes care of prototype and small-batch production in its in-house laboratory, starting with the very first component.
“In our Contract Manufacturing Hub, we offer a wide range of highly specialized fabrication and assembly processes for the precise and reliable processing of semiconductor chips.“
Tresky’s state-of-the-art facilities and technologies enable the development of customized solutions that meet the specific requirements of its customers. The use of innovative processes not only increases efficiency but also maximizes the quality of the packages.
“Our customized solutions allow for fast and efficient project implementation, significantly reducing development times and time-to-market.“
Tresky’s experienced team provides customers with expert advice. As an external partner, Tresky manufactures small series quickly and in line with requirements, without customers having to build up their own production capacity.
“We help to reduce production costs and times without compromising on quality.“
Further information can be found in the white paper Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries PDF (EN), which is available in the download area of the company website.