Tresky GmbH is launching a new product offensive in fall 2021. Managing Director Daniel Schultze and his team will be presenting three new options at productronica. “Despite Corona, business has continued as normal for us. This also applies to our development department, which has continued to work on customer projects and new products throughout this period,” says Schultze, looking back on the last few months. “That’s why productronica comes at just the right time to present these new developments to our customers and interested trade visitors,” Schultze continues.
For example, Tresky has developed an air-bearing bond head for force-controlled placement of highly sensitive components. “Due to continuous miniaturization in the electronics industry, newly developed semiconductor chips are becoming smaller and thinner. In addition, new materials used in the manufacture of chips have been added. In the past, silicon (Si) or germanium (Ge) were used in most cases for semiconductor manufacturing. Driven in particular by the development of new generations of laser, LED, diode, and transistor semiconductors, materials such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC) are now also being used,” explains Schultze. However, some of these compound semiconductors, such as gallium arsenide (GaAs), have the disadvantage that, despite their positive electrical properties, they are not very mechanically stable and break easily. This poses enormous challenges for chip bonding in assembly and connection technology.
In order to achieve minimal contact forces during bonding, the engineers at Tresky GmbH have developed an air-bearing bond head that enables play-free and friction-free vertical movement when the chip is placed on the substrate. The air bearing is kept in a floating state by vacuum or compressed air and controlled by a proportional valve that can operate from vacuum to atmospheric pressure. The bonding head detects changing weights and can thus maintain its floating state at all times. This results in weight compensation for the component. By changing the proportional valve from vacuum to pressure, a defined weight force can now be exerted in the vertical direction on the semiconductor component to be placed and attached or picked up with precise force.
Tresky also presented a new vibratory feeder. Using vibration technology, this universal feeding system feeds components that are delivered as bulk material into the processing process. “The feeder is designed so that the components are positioned in a small, open, vibrating container in such a way that the head camera can clearly and precisely recognize the individual components. At the same time, the vibrations position them so that the top of the component faces upwards. 99% of all component geometries are compatible with our vibratory feeder,” explains Schultze. Depending on the quantity of components, different hopper sizes are available from which the components enter the vibration container. The feeder can be easily integrated into all existing Tresky die bonding systems without any significant conversion time.
The portfolio of new products at the trade fair is rounded off with a new wafer handling system. This is a precise and reliable wafer feeder that can process wafers up to 300 mm in size and with a maximum weight of 1 kg. End effectors using vacuum or mechanical clamping are available for picking up the wafers. A pre-align function can be integrated as an option. At productronica 2021, Tresky will be presenting its die bonders and various options in Hall B2, Booth 312.
In addition to participating in the trade fair, Schultze and his marketing team also worked on a new online presence. Schultze knows that the coronavirus crisis has clearly shown that a website must be more than just a product showcase. “For this reason, we decided to set up a new website. In the future, we want to ensure even better information transfer to our customers and better information quality,” says Schultze. The new online presence represents Tresky GmbH in a new, modern design.