“The new website focuses on our DIE Bonder solutions for the versatile processes and applications in assembly and connection technology (packaging),” explains Daniel Schultze, Managing Director of Tresky GmbH. “First and foremost, our customers are concerned with the implementation of their application – i.e. the solution to their specific problem. The final machine platform selection during implementation is rather secondary . The same applies to the options, which are configured on a modular and customized basis depending on the process and customer requirements,” continues Schultze.
Tresky’s bonder solutions are used in almost all areas of packaging technology. The DIE bonder, which is customized to the process requirements of international customers, guarantees high precision, intuitive operation and maximum turnkey solutions. We are constantly developing new ideas and technologies to meet the ever-changing demands of the global market. Our focus lies on finding innovative solutions that are efficient, sustainable and competitive,” continues Schultze. The machine platforms, from the T-6000 to the T-8000 and the latest product T-7000, which is designed for submicron bonding, are also presented in detail on the new website. The same applies to the options. “As we have a large number of options due to our modular product philosophy, we will gradually integrate these on the website,” explains Schultze.
Tresky will be presenting the entire DIE bonding portfolio to trade visitors at productronica 2023 in Munich from 14 to 17 November in hall B2, stand 312.