Reliable DIE Bonder Solutions for Current and Future Electronic Products

Tresky’s system solutions cover the entire spectrum of DIE bonding. The modularly configured machines can be individually tailored to the manufacturing requirements of international customers and, in addition to high precision, ensure ease of operation and a high degree of flexibility. All common DIE bonding processes can be implemented in the Tresky systems. Additional DIE bonders for sintering and photonic bonding cover the demand for innovative solutions for the current needs of the global market.