Technology

Die Attach

Die Attach is the standard method for mechanical attachment in the composition- and bonding technology. more

Flip Chip Bonding

During the flip-chip process, the chip is placed directly onto the circuit boards, without additional connection wires and with the active surface facing down. more

Thermosonic Flip-Chip Bonding

Thermosonic flip-chip bonding is an advanced, solderless technology for area-array connections. more

Adhesive Die Bonding

 

Adhesive bonding is used­ to fasten two surfaces together, usually producing a smooth bond. more