Adhesive Die Bonding

Adhesive bonding is used­ to fasten two surfaces together, usually producing a smooth bond. This joining technique involves glues, epoxies, or various materials that bond by heat, pressure, or time. A large fraction of modern glues are carbon-based petrochemical derivatives. These can be used to bond almost any combination of surfaces, either by direct contact or by fastening both surfaces to a third as with adhesive tapes. Glues can serve as bonding agents for strong structural materials. The organic or ceramic adhesives can be applied by spinning, printing, transferring or by dispensing on a cleaned or activated surface. Besides temperature activated adhesives there are also UV activated adhesives or especially adjusted adhesives to be used for MEMS, electrical components or photo lacquer. Adhesive bonding is often used for wafer bonding.