DIE Attach is the standard method for mechanical attachment in the composition- and bonding technology. It is tightly connected to flip-chip bonding, but actually goes beyond this. It is a process step in which the bare DIEs are attached on a substrate (circuit board, ceramic substrate ...). DIE bonding is usually the last step before applying electrical contact. A very thin layer of adhesive is applied on the surface. After this a tweezer (DIE collet) will take the bare dies and push these on the adhesive layer. DIEs can also be attached to the substrate by soldering, glazing or eutectic welding. DIE bonding during the flip-chip process allows placement and at the same time contacting the die on the substrate by the melting the solder bumps.