What is Hybrid Alignment?
Tresky Hybrid Alignment combines passive alignment and active alignment on a single DIE bonder platform. This allows complex PICs and photonic packages with varying alignment requirements to be flexibly assembled within a single system.
T-200 Bonding Plattform for Research, Development, and Prototyping
The Tresky T-200 is a precision die bonding platform designed for photonics, MEMS, semiconductor and sensor packaging applications. Its flexibility and accuracy make it ideal for research, development, prototyping and pilot production environments.
Precision for the future: Tresky Automation introduces Active Alignment in Packaging and Interconnection Technology (AIT) for high-integrated photonics systems
Tresky Automation takes active alignment in photonics systems to a new level. The machine platforms combine nanometer precision, modular processes, and maximum flexibility for research, development, and industrial manufacturing of optoelectronic assemblies.
Microelectronics for military lead: Tresky presents robust DIE bonding and fiber optic technologies for modern defense systems
With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing. Tresky GmbH, a leading provider of precision solutions for semiconductor assembly, specifically addresses the performance requirements of the security and defense industry with its DIE bonder systems and manufacturing services.
Tresky Automation presents contract manufacturing for small and medium quantities at PCIM
Tresky Automation will present its new contract manufacturing service for packaging at PCIM 2025. This innovative service offers customized solutions for various areas, including photonics, optoelectronics, sintering for power electronics, flip chip bonding, and many other assembly and connection technologies.
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures and excellent mechanical strength, making it particularly suitable for advanced applications such as RF components, MEMS and LED packaging.
Tresky Automation is strengthening its portfolio by investing in the contract manufacturing sector
Tresky Automation is pleased to announce the latest addition to its machine park in the field of contract manufacturing. Customers will now benefit from a state-of-the-art vacuum soldering system and a high-performance sintering press with a maximum contact force of up to 15 kN.
ESCATEC pushes new boundaries in micro-electronics with UV enhanced die bonder technology
Electronics manufacturing services (EMS) provider ESCATEC has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky GmbH, as a leading manufacturer of [bns_post_link id="4141" text="DIE bonding systems"], offers customized solutions that are specially tailored to the requirements of [bns_post_link id="4681" text="DIE bonding of laser- and photodiodes"].
Tresky offers DIE sorting as a contract service in semiconductor manufacturing
The Tresky Contract Manufacturing Hub offers more than just prototyping and small series production. We also provide DIE sorting for wafers up to 12″, along with semiconductor packaging services.