Tresky will showcase solutions for advanced packaging and photonics at SEMICON Europe 2026
Tresky will present innovative solutions for advanced packaging, photonics and heterogeneous integration at SEMICON Europe 2026. The focus will be on Active Alignment, Digital Beamsplitter and the T-200 Lab Bonder for high-precision bonding processes.
Tresky Unveils New Lab Bonder for High-Precision Process Development in Microelectronics and Photonics
Tresky’s new Lab Bonder delivers submicron accuracy, multiple bonding technologies and maximum flexibility for semiconductor, photonics and R&D applications.
Tresky makes the optical beamsplitter obsolete in DIE bonding
Tresky replaces the traditional optical beamsplitter with a digital solution. Images from up-looking and down-looking cameras are combined via software, enabling flexible and direct control of the alignment process.
Tresky reaches first milestone for Advanced Packaging Demo Lab in Taiwan
Tresky GmbH, together with Niching Industrial Corporation and Bondtronics, is moving forward with the establishment of an Advanced Packaging Demo Lab in Hsinchu, Taiwan. The platform is intended to support the development, testing, and demonstration of sophisticated DIE bonding and packaging processes in the future.
What is Hybrid Alignment?
Tresky Hybrid Alignment combines passive alignment and active alignment on a single DIE bonder platform. This allows complex PICs and photonic packages with varying alignment requirements to be flexibly assembled within a single system.
T-200 Bonding Plattform for Research, Development, and Prototyping
The Tresky T-200 is a precision die bonding platform designed for photonics, MEMS, semiconductor and sensor packaging applications. Its flexibility and accuracy make it ideal for research, development, prototyping and pilot production environments.
Precision for the future: Tresky Automation introduces Active Alignment in Packaging and Interconnection Technology (AIT) for high-integrated photonics systems
Tresky Automation takes active alignment in photonics systems to a new level. The machine platforms combine nanometer precision, modular processes, and maximum flexibility for research, development, and industrial manufacturing of optoelectronic assemblies.
Microelectronics for military lead: Tresky presents robust DIE bonding and fiber optic technologies for modern defense systems
With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing. Tresky GmbH, a leading provider of precision solutions for semiconductor assembly, specifically addresses the performance requirements of the security and defense industry with its DIE bonder systems and manufacturing services.
Tresky Automation presents contract manufacturing for small and medium quantities at PCIM
Tresky Automation will present its new contract manufacturing service for packaging at PCIM 2025. This innovative service offers customized solutions for various areas, including photonics, optoelectronics, sintering for power electronics, flip chip bonding, and many other assembly and connection technologies.
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures and excellent mechanical strength, making it particularly suitable for advanced applications such as RF components, MEMS and LED packaging.