Tresky Automation is strengthening its portfolio by investing in the contract manufacturing sector
Tresky Automation is pleased to announce the latest addition to its machine park in the field of contract manufacturing. Customers will now benefit from a state-of-the-art vacuum soldering system and a high-performance sintering press with a maximum contact force of up to 15 kN.
ESCATEC pushes new boundaries in micro-electronics with UV enhanced die bonder technology
Electronics manufacturing services (EMS) provider ESCATEC has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky GmbH, as a leading manufacturer of [bns_post_link id="4141" text="DIE bonding systems"], offers customized solutions that are specially tailored to the requirements of [bns_post_link id="4681" text="DIE bonding of laser- and photodiodes"].
Tresky offers DIE sorting as a contract service in semiconductor manufacturing
The Tresky Contract Manufacturing Hub offers more than just prototyping and small series production. We also provide DIE sorting for wafers up to 12″, along with semiconductor packaging services.
Tresky allows dispensing of over 100 mm² for large area sintering applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various applications in e-mobility, as they offer high power density and efficiency. However, connecting these components is challenging. Tresky GmbH from Berlin is presenting dispensing for Large Area Sintering at PCIM Europe […]
Manual mode for maximum control and flexibility with DIE bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users and makes it possible to achieve reliable die bonding results within a very short time. The manual mode is particularly suitable for applications that require quick iterations and adjustments while keeping highest precision. […]
Fluxless soldering using formic acid vapor for optoelectronics
Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.
Tresky Automation launches new website
The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design for productronica 2023. The new website includes different focus and structure for the bonder solutions, which should help selecting proper information.
Tresky unveils its latest breakthrough product at productronica 2023: the photonics bonder for sub-micron use in nano- and optoelectronics
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Tresky presents metallic sintering for power electronics at productronica 2023
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year’s productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.