productronica / SEMICON Europa

SEMICON Europa is Europe’s leading platform for the semiconductor and microelectronics industry and will take place from November 18 to 21, 2025, at Messe München, alongside productronica. This partnership creates Europe’s most important event covering the entire electronics manufacturing chain. The focus will be on current topics such as innovative manufacturing technologies, 3D integration, new materials, sustainable production strategies, and future applications in areas such as automotive, medical technology, and smart manufacturing. The event is aimed at decision-makers and professionals from across the microelectronics ecosystem, from chip design, materials, and manufacturing to MEMS, sensor technology, and IoT applications.

Tresky presents its latest innovations in the field of DIE bonding, specifically photonics bonding

Tresky is using SEMICON Europe to present its latest DIE bonding innovations to a European audience of experts, showcase its contract manufacturing service, and establish valuable contacts in key industries. In particular, Tresky will be presenting a new product in the field of photonics bonding.

Further details are not yet available at this time. However, we will inform you in good time before the trade fair.

Active Alignment for Photonics Systems

Active alignment of optical components is central to modern photonics manufacturing. Unlike passive alignment, which positions components based solely on geometric features, active alignment uses real-time signal feedback during assembly. This ensures that not only the geometric center is achieved, but also the actual maximum light coupling performance. This is essential for applications with single-mode fibers, silicon photonics systems, or hybrid modules with complex geometries. Tresky’s active alignment combines nanometer accuracy with flexible assembly methods for all common coupling processes.

Photonics bonder for sub-micron applications in nanoelectronics and optoelectronics

The Photonics Bonder, which we are presenting at our booth, provides manufacturers in the optoelectronics industry with a customized solution for the precise DIE bonding of lasers and photodiodes. The Photonics Bonder ensures high-precision placement, reliable connections, and optimal thermal management. This is crucial for the performance, service life, and stability of sensitive components such as laser diodes, photodetectors, and VCSELs. Thanks to its modular design and support for various bonding technologies, from eutectic to UV bonding, the bonder is suitable for development, prototyping, and series production.

Metallic sinter bonding

During sintering, the chip is bonded to the substrate using silver paste, creating an excellent electrical and thermal connection. This is achieved using heat (over 220 °C) and pressure of at least 50 bar up to 300 bar. The silver particles are bonded together through diffusion processes. The advantage over normal soldering processes is the very high thermomechanical stability, which is particularly important in power electronics.

productronica / SEMICON Europe

Tresky presents its latest innovations in the field of DIE bonding, specifically photonics bonding

Active Alignment for Photonics Systems

Photonics bonder for sub-micron applications in nanoelectronics and optoelectronics

Metallic sinter bonding