Events

An overview of our trade fair appearances and events

As a leading company in the field of DIE bonding, we regularly take part in global trade fairs and events related to the semiconductor industry to present our latest products and innovations. Please contact us in advance for a personal appointment. Here you will find an overview of our upcoming trade fair participations:

Dekoratives Bild
Dekoratives Bild
SPIE Photonics West Exhibition
Logo Semicon Korea 2026
SEMICON Korea 2026
Logo Semicon China 2026
SEMICON China 2026
Dekoratives Bild
SEMICON Southeast Asia 2026
Semicon Taiwan Logo
SEMICON Taiwan 2026
Logo IEEE ESTC
IEEE ESTC 2026
Logo SEMICON India
SEMICON India 2026
Logo Semicon Europa 2026
SEMICON Europa 2026
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