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Bonding Options

Stamping Module

Many applications require a connection medium between chip and substrate. This can be necessary for mechanical stability, electrical contacting or for better soldering.

During stamping, a stamp transfers a liquid or paste-like medium, such as flux, adhesives or solder paste, onto a substrate or component surface.

In contrast to a dispenser, the medium does not flow through a needle onto a defined surface; instead, the stamping tool transfers the medium onto the substrate or another carrier according to its geometry. Stamping tools are also called pin transfer or pad printing tools.

The tools are available in many different geometries and designs, e.g. with a cross, a star, a single dot or even as a multiple pin grid.

Stamping is very precise, can transfer different shapes and realise very small dots.

The stamping modules can be integrated into all DIE bonders from our company.

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