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Bonding Options

Wafer Handling System

The Wafer Handling System is a precise and reliable wafer feeder that can pick up 300 mm wafers with a maximum weight of up to 1 kg. Vacuum, edge and custom end effectors are available to the end user for pick-up. A pre-align function can be integrated as an option.

The Wafer Handling System can be integrated into all DIE bonders from our company.