Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder.
Air-bearing bond head, new vibrating feeders and a new wafer handling system
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg, Germany, May 10-12, 2022, in Hall 4A, Booth 234: a new precision placement head, a vibrating feeder and a new wafer handler.
Tresky presents air-bearing bond head, new vibratory feeders, and a new wafer handling system at productronica
At this year’s productronica, Tresky GmbH is presenting three new options for its die bonders: a new precision placement head, a vibratory feeder, and a new wafer handler. In addition, the company from Hennigsdorf near Berlin is also presenting itself online in a new light and has launched a new website just in time for the leading international trade fair.