Tresky expands digital service support with Pink Flamingo
The Pink Flamingo document management and support system offers a wide range of possibilities for servicing machinery and equipment. Tresky GmbH uses Pink Flamingo and therefore has the possibility to efficiently provide information and instructions about the Tresky-DIE Bonder to customers. These in turn can access it quickly and easily. In addition, supporting services can also be accessed digitally while saving time.
Electronic low-voltage drive module with multifunctional high-current circuit carrier
Tresky GmbH is part of the ProMuPower project at Kiel University of Applied Sciences, which focuses on the development of high-performance power modules and the associated manufacturing processes. The power modules are being developed for the generation of sustainable energy and for use in electromobility.
Sintering as a key technology for the energy transition and e-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky GmbH from Hennigsdorf near Berlin has been working on this key technology for some time and will present further product and process innovations in 2023 as part of additional development steps.
Highest machine precision thanks to Mother Nature
Particularly when it comes to the highest precision requirements, machine builders from different industries like to rely on a material that is thousands of years old, from the depths of the earth: granite. Particularly when the components to be processed are extremely small, precision comes into even stronger focus, as in the semiconductor industry with DIE bonding.
Perfect connection
The DIE bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight.
Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder.
Air-bearing bond head, new vibrating feeders and a new wafer handling system
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg, Germany, May 10-12, 2022, in Hall 4A, Booth 234: a new precision placement head, a vibrating feeder and a new wafer handler.
Tresky presents air-bearing bond head, new vibratory feeders, and a new wafer handling system at productronica
At this year’s productronica, Tresky GmbH is presenting three new options for its die bonders: a new precision placement head, a vibratory feeder, and a new wafer handler. In addition, the company from Hennigsdorf near Berlin is also presenting itself online in a new light and has launched a new website just in time for the leading international trade fair.