T-200
Compact, High-Precision Platform for Research, Development, and Prototyping
High-Precision Bonding for R&D
The T-200 system is a compact, high-performance DIE bonding platform designed for precise DIE attach and advanced packaging processes in demanding research and development environments. It combines the key features of large automated systems with a particularly space-saving design, making it ideal for laboratory applications, prototyping, and process development.
The solid granite base ensures high submicron accuracy, reliable process stability, and flexible integration of various DIE bonding processes. Manual and automatic operating modes enable both rapid trial runs and the development of reproducible and validatable processes in microelectronics, photonics, medtech, and advanced packaging.
Technical Data
| Working Area | 200 x 240 mm |
| Substrate Area | 400 x 450 mm |
| Z-Movement | 33 mm |
| Chip Rotation max. | up to 360° |
| Bond Force Range | 0,01 N up to 350 N * |
| Footprint | 600 x 750 mm |
* Up to 1.000 N on request
From the Feasibility Study, through Prototype Development, to Process Validation
Intuitive operation, high-precision alignment, and reliable process performance make the T-200 system a powerful platform for research, development, and prototyping. Thanks to its compact design and a footprint of less than half a square meter, the system saves valuable lab space without compromising on precision, stability, or functionality.
Equipped with linear motors and high-precision direct measurement systems, the T-200 impresses with a generous working area and outstanding bonding performance. The system is ideally suited for a wide range of applications in assembly and joining technology, combining high precision, flexibility, and speed. Thanks to its modular design, the T-200 can be used efficiently in both prototype development and series production.
This makes the T-200 system ideal for rapid feasibility studies, prototype development, process validation, and the transition to reproducible manufacturing processes.
Product data sheets
T-200
Product
Highlights
- Manual mode
- Multichip capable
- Post-bond-inspection
- Software programmed temperature control
- OCR
- Traceability
- MES
- Automated dispensing needle calibration
- Customized partitioning
- Scrubbing
- Different image recognition
Moduls and
Options
- Air bearing bond head
- Stamping module
- Component feeders
- Formic Acid Module
- UV-indexer
- WRGB ring light
- Heating plates (up to 450°C; ΔT-Ramps up to 60 K/s)
- Inert gas
- Automatic tool change
- Various dispensing technologies
- Tool heating
- Various feeder widths
- Uplooking camera
- ID-scanner
- DIE flipping-unit
- Heated inert gas
Customized
Applications
- DTF / DAF bonding
- Multi-DIE bonding
- MEMS
- SMD bonding
- 3D-packaging (SiP)
- Laser-bar-stacking
- Glass bonding
- TO Header bonding
- Vcsel bonding
- RFID assambly
- DIE sorting