SEMICON Taiwan 2026 | Tresky active alignment, hybrid alignment & Lab Bonder

Tresky will showcase active and hybrid alignment, as well as the new Lab Bonder for research and development, at Southeast Asia’s leading semiconductor and microelectronic trade show.

SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems, but also a bridge that facilitates smooth collaboration between the industry, the government, science, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions: Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration, and continues providing various channels and activities that meet the companies’ marketing and promotional needs.

Tresky presents its latest innovations in the field of DIE bonding, with focus on photonics bonding

Tresky is using SEMICON Taiwan to showcase its latest innovations in the field of DIE bonding to an industry audience, including its new active and hybrid alignment technologies. In addition, the new Lab Bonder will be unveiled in Asia for the first time.

Active alignment for photonics systems

Active alignment of optical components is central to modern photonics manufacturing. Unlike passive alignment, which positions components based solely on geometric features, active alignment uses real-time signal feedback during assembly. This ensures that not only the geometric center is achieved, but also the actual maximum light coupling performance. This is essential for applications with single-mode fibers, silicon photonics systems, or hybrid modules with complex geometries. Tresky’s active alignment combines sub-micrometer accuracy with flexible assembly methods for all common coupling processes.

Hybrid alignment? What is that!

Tresky’s hybrid alignment combines passive alignment and active alignment in a single DIE bonder. This allows different alignment tasks within an advanced package to be performed on a single machine, either independently, in combination, or component-specific within the same process environment.

Curious? Want to learn more? Schedule an appointment and stop by our booth.

Lab Bonder for R&D and prototyping

Tresky is expanding its portfolio with the new Lab Bonder, based on the new T-200 machine platform. The compact bonding platform combines submicron accuracy, maximum process flexibility, and a wide range of bonding technologies in a footprint of less than half a square meter.

Designed specifically for research and development environments, this high-precision system provides a powerful platform for demanding applications in microelectronics, photonics, and modern assembly and interconnection technologies. The Lab Bonder supports companies and research institutions in the development and validation of new packaging and bonding processes.

From Prototyping to Production

Text: With the T-200 Lab Bonder our customers achieve excellent performance results as described above. But the Lab Bonder also opens a new door to mass production on one of our large-scale production systems, the T-7000. Process parameters, recipes, and settings can be transferred from the T-200 to the T-7000. This means that an already validated process can be used to quickly ramp up production in mass manufacturing.

The T-7000 machine platform has been developed for use in nanoelectronics and optoelectronics due to its precision. As is standard at Tresky, the bonder platform is based on granite, so that the highest possible precision can be guaranteed for optical components such as VCSELs, lasers, photodiodes, IR sensors or for the development of quantum technologies.