Tresky Hybrid Alignment combines passive alignment and active alignment in a single DIE bonder. This allows different alignment tasks within an advanced package to be performed on a single machine, either independently, in combination, or component-specific within the same process environment.
In modern advanced photonics packaging applications and complex PICs (photonic integrated circuits), not all components have the same positioning and accuracy requirements. Some components can be precisely aligned passively using registration marks, edges, patterns, or other visual reference points. Other components require active alignment, in which a live optical signal determines the final positioning.
This is exactly where Tresky Hybrid Alignment comes into play. Passive alignment processes and active alignment are available on the same platform. For example, one side of a PIC package can be passively positioned, while another side is actively optimized for maximum optical coupling, without having to switch to a second specialized machine.
This reduces process transfers, saves valuable cleanroom space, and increases flexibility in the development and manufacturing of complex photonic assemblies. Customers and users benefit from a platform that combines traditional DIE bonding processes, passive submicron alignment, and optical active alignment within a flexible system environment.
Tresky Hybrid Alignment is suitable for silicon photonics, optical transceivers, laser and photodiode modules, sensor technology, LiDAR, quantum photonics, optical interconnects, and other advanced packaging and microelectronics applications.
Would you like to learn how Tresky Hybrid Alignment can make your photonics packaging processes more flexible and efficient? Then talk to our experts: