The T-200 system is a compact, high-performance DIE bonding platform designed for precise DIE attach and advanced packaging processes in demanding research and development environments. It combines the key features of large automated systems with a particularly space-saving design, making it ideal for laboratory applications, prototyping, and process development.
The solid granite base ensures high submicron accuracy, reliable process stability, and flexible integration of various DIE bonding processes. Manual and automatic operating modes enable both rapid trial runs and the development of reproducible and validatable processes in microelectronics, photonics, medtech, and advanced packaging.