Based on the proven T-6000-L series, the DIE Bonder T- 6000-L/G has been further enhanced

Improvements include a stable granite gantry and a high-precision control system for  the X, Y and Z axis. The T-6000-L/G offers advanced repeatability and elevated accuracy results for high precision placement applications. Optionally, the T-6000-L/G can be upgraded with a loading and unloading module to further optimize cycle times as well as reduce down-time. The system can be further expanded at any time with additional options. In this way, our customers receive a system tailored to their needs. The unique manual mode supports die bonding proto-types and R&D projects without time consuming programming.

The intuitive software enables simple and easy operation of the system. This model covers all common connection technologies.

Tresky DIE Bonder


Rotate the machine 360 ° with the mouse.


Technical data

Travel Range with Wafer:
410 mm x 420 mm
Wafer Size:
2” – 8” (Ring & Frame)
Travel Range w/o Wafer:
550 mm x 420 mm
100 mm
Chip Rotation max.:
up to 360°
Bond Force Range:
10 g – up to 10.000 g
Axis Speed:
up to 1.8 m/sec
Placement Accuracy:
2.5 μm @ 3 sigma
Axis Resolution:
XYZ: 0.01 μm, Theta: 0.01°
Min./Max. Component Size:
80 μm – 100 mm

Data sheet

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