Tresky DIE Bonder
T-6000-L/G
Based on the proven T-6000-L series, the DIE Bonder T- 6000-L/G has been further enhanced
Improvements include a stable granite gantry and a high-precision control system for the X, Y and Z axis. The T-6000-L/G offers advanced repeatability and elevated accuracy results for high precision placement applications. Optionally, the T-6000-L/G can be upgraded with a loading and unloading module to further optimize cycle times as well as reduce down-time. The system can be further expanded at any time with additional options. In this way, our customers receive a system tailored to their needs. The unique manual mode supports die bonding proto-types and R&D projects without time consuming programming.
The intuitive software enables simple and easy operation of the system. This model covers all common connection technologies.
Rotate the machine 360 ° with the mouse.
Technical data
- Travel Range with Wafer:
- 410 mm x 420 mm
- Wafer Size:
- 2” – 8” (Ring & Frame)
- Travel Range w/o Wafer:
- 550 mm x 420 mm
- Z-Movement:
- 100 mm
- Chip Rotation max.:
- up to 360°
- Bond Force Range:
- 10 g – up to 10.000 g
- Axis Speed:
- up to 1.8 m/sec
- Placement Accuracy:
- 2.5 μm @ 3 sigma
- Axis Resolution:
- XYZ: 0.01 μm, Theta: 0.01°
- Min./Max. Component Size:
- 80 μm – 100 mm
Data sheet
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