TRESKY’s entry-level DIE bonder (standard machine) is the Model T-6000-L

This is a fully automatic placement system for universal as well as specific use. Designed for maximum flexibility, the T-6000-L can be upgraded with a variety of modular option.

The T-6000-L insures repeatability and highly accurate results for most placement application. The unique manual mode supports die bonding proto-types and R&D projects without time consuming programming.

This model covers all common interconnect technologies.

Tresky DIE Bonder


Rotate the machine 360 ° with the mouse.


Technical data

Travel Range with Wafer:
400 mm x 410 mm
Wafer Size:
2” – 8” (Ring & Frame)
Travel Range w/o Wafer:
540 mm x 410 mm
100 mm
Chip Rotation max.:
up to 360°
Bond Force Range:
10 g – up to 5.000 g
Axis Speed:
up to 1.8 m/sec
Placement Accuracy:
8 μm @ 3 sigma
Axis Resolution:
XYZ: 0.01 μm, Theta: 0.01°
Min./Max. Component Size:
80 μm – 100 mm

Data sheet

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