Tresky DIE Bonder
T-6000-L
TRESKY’s entry-level DIE bonder (standard machine) is the Model T-6000-L
This is a fully automatic placement system for universal as well as specific use. Designed for maximum flexibility, the T-6000-L can be upgraded with a variety of modular option.
The T-6000-L insures repeatability and highly accurate results for most placement application. The unique manual mode supports die bonding proto-types and R&D projects without time consuming programming.
This model covers all common interconnect technologies.
Rotate the machine 360 ° with the mouse.
Technical data
- Travel Range with Wafer:
- 400 mm x 410 mm
- Wafer Size:
- 2” – 8” (Ring & Frame)
- Travel Range w/o Wafer:
- 540 mm x 410 mm
- Z-Movement:
- 100 mm
- Chip Rotation max.:
- up to 360°
- Bond Force Range:
- 10 g – up to 5.000 g
- Axis Speed:
- up to 1.8 m/sec
- Placement Accuracy:
- 8 μm @ 3 sigma
- Axis Resolution:
- XYZ: 0.01 μm, Theta: 0.01°
- Min./Max. Component Size:
- 80 μm – 100 mm
Data sheet
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