The T-8000-G DIE Bonder is the result of Tresky’s continuous engineering development

Based on solid granite, equipped with linear motors and high-resolution direct measuring systems, the machine offers the largest working range within the Tresky product portfolio. In addition, the T- 8000-G is compatible with numerous existing options as well as custom-built options. This bonder is predestined for any application within the assembly and joining technology. This system offers a larger work area than the T-6000-L/G platform and it can handle 12” wafers.

This model covers all common connection technologies.

Tresky DIE Bonder


Rotate the machine 360 ° with the mouse.


Technical data

Travel Range with Wafer:
590 mm x 560 mm
Wafer Size:
2” – 12” (Ring & Frame)
Travel Range w/o Wafer:
740 mm x 560 mm
120 mm
Chip Rotation max.:
up to 360°
Bond Force Range:
10 g – up to 10.000 g
Axis Speed:
up to 1.8 m/sec
Placement Accuracy:
2.5 μm @ 3 sigma
Axis Resolution:
XYZ: 0.01 μm, Theta: 0.01°
Min./Max. component size:
80 μm – 100 mm

Data sheet

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