Tresky DIE Bonder
T-8000-G
The T-8000-G DIE Bonder is the result of Tresky’s continuous engineering development
Based on solid granite, equipped with linear motors and high-resolution direct measuring systems, the machine offers the largest working range within the Tresky product portfolio. In addition, the T- 8000-G is compatible with numerous existing options as well as custom-built options. This bonder is predestined for any application within the assembly and joining technology. This system offers a larger work area than the T-6000-L/G platform and it can handle 12” wafers.
This model covers all common connection technologies.
Rotate the machine 360 ° with the mouse.
Technical data
- Travel Range with Wafer:
- 590 mm x 560 mm
- Wafer Size:
- 2” – 12” (Ring & Frame)
- Travel Range w/o Wafer:
- 740 mm x 560 mm
- Z-Movement:
- 120 mm
- Chip Rotation max.:
- up to 360°
- Bond Force Range:
- 10 g – up to 10.000 g
- Axis Speed:
- up to 1.8 m/sec
- Placement Accuracy:
- 2.5 μm @ 3 sigma
- Axis Resolution:
- XYZ: 0.01 μm, Theta: 0.01°
- Min./Max. component size:
- 80 μm – 100 mm
Data sheet
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