Tresky GmbH, together with Niching Industrial Corporation and Bondtronics, has taken an important first step towards establishing a joint demonstration and application lab for advanced packaging and DIE bonding in Taiwan. The planned Advanced Packaging Demo Lab in Hsinchu County is intended to serve as a platform for process development, application testing, and technology demonstrations related to sophisticated packaging and bonding technologies. Through this joint project, the three partners aim to pool their respective expertise and support users in the development and industrialization of new packaging and bonding processes. The focus is on the transition from the initial process concept through testing and optimization to an industrially viable application.
Focus on sophisticated packaging and bonding processes
The planned Demo Lab will focus in particular on technologies that are of great importance for future semiconductor, photonics, and power electronics applications. These include, among others, advanced packaging and heterogeneous integration, high-precision DIE bonding, photonics and optoelectronics, as well as DIE-to-DIE and DIE-to-substrate integration. In addition, customer-specific processes and applications will be developed and tested. The focus will also be on power module applications and new assembly concepts for research, development, and production.
“This creates an environment in which companies can investigate new processes under realistic conditions and test various packaging and bonding concepts.”
The goal is to accelerate development processes and bring new applications to industrial implementation more quickly.
Closer customer-oriented process development
Taiwan plays a crucial role in this context. Taiwan is one of the world’s most important hubs for the semiconductor industry, with the Hsinchu region serving as one of the country’s key technology clusters. With its planned Demo Lab, Tresky is bringing its precision DIE bonding technology directly into this industrial environment. This expertise is complemented by Niching’s strong position within the Taiwanese semiconductor industry, as well as by Bondtronics’ local application and market expertise.
The collaboration enables process development, demonstrations, and customer-specific applications to be brought closer to the end user. This allows companies to assess early on how new packaging and integration concepts can be technically implemented and which process parameters are required for stable implementation.
A strategic move for Tresky GmbH
For Tresky GmbH, this project represents an important strategic step. The planned Demo Lab will expand the company’s presence in one of the world’s most important semiconductor markets while also creating a platform for the joint development of future packaging solutions. At the heart of this effort is a partnership-based approach: developing processes, testing applications, and working with customers to implement solutions for the future requirements of semiconductor manufacturing. The first milestone that has now been reached forms the foundation for the continued development of the Advanced Packaging Demo Lab in Taiwan.
Would you like to learn more about advanced packaging and high-precision DIE bonding processes? Talk to our experts about your application and specific process requirements.